PacTech – Packaging Technologies GmbH (PacTech), ein renommierter Hersteller von lasergestützten Solder-Jetting- und Chip-Bonding-Anlagen sowie weltweit agierender Wafer-Level-Packaging-Dienstleister, freut sich, eine Investition von 10 Millionen US-Dollar zur Erweiterung der Kapazität […]
Autor: Firma Pac Tech – Packaging Technologies
Pac Tech Asia Invests in Capacity Expansion of Malaysian Factory
Pac Tech Packaging Technologies GmbH (PacTech), a leading manufacturer of high-performance laser-assisted solder jetting and die bonding equipment, and a globally recognized wafer level packaging subcontractor, is proud to announce […]
Pac Tech – Packaging Technologies GmbH Appoints New Vice Presidents to Lead Business Units
Pac Tech – Packaging Technologies GmbH (PacTech), a renowned manufacturer of high-performance laser-assisted solder jetting and die bonding equipment, along with its role as a globally operating wafer level packaging […]
Forming of Advanced THT-Interconnects using SB² Laser Solder Jetting Process
Conventional methods of soldering THT-contacts face growing limitations with new-generation products. Finer pitches, more intricate geometries, more excellent aspect ratios, thermally sensitive substrates, and an overall call for a flux-free […]