ODU expands product portfolio

The innovative Expanded Beam Performance (EBP) technology, which is already available in the robust AMC Series T connectors, is now also available for the MINI-SNAP Series K, MEDI-SNAP, ODU-MAC Silver-Line and ODU-MAC White-Line product lines.

As a non-contact lens technology, Expanded Beam Performance products offer a game-changing interface for fiber optic systems. EBP technology achieves numerous advantages, including low attenuation, virtually no cleaning or maintenance requirements and a long service life. These advantages make EBP the ideal solution for applications where maximum reliability and performance are required.

Future-proof EBP technology impresses with optimum performance

– Low attenuation levels
For maximum signal quality and low latency, EBP solutions achieve attenuation levels that are even lower than the outstanding values of conventional physical contact (PC) solutions.

– No cleaning or maintenance required
Cleaning the ferrule is only necessary in the case of extreme soiling. Under normal conditions no maintenance is required, and the maximum service life can be achieved without a single cleaning process.

– Long service life
The contactless transmission means there is no wear on the contact elements, so that at least 50,000 mating cycles can be achieved.

AMC Series T Expanded Beam Performance

The previously available combination consists of EBP technology and a robust circular connector for harsh environments. With its innovative 3-in-1 locking system, non-reflective surface and high resistance to external influences, the AMC Series T has already proven its worth as an EBP solution.

MINI-SNAP Series K Expanded Beam Performance

The classic circular metal connector is characterized by its safety and flexibility. This is available with the proven push-pull locking system and protects the fiber optic transmission with an IP68 protection class. This is the smallest 12-lens plug solution on the market.

MEDI-SNAP Expanded Beam Performance

Made of high-quality plastic, the Medi-Snap is up to 75% lighter than comparable products. Its features make it ideal for mobile applications, especially in the medical sector.

ODU-MAC Silver-Line & White-Line EBP module

The integration in a modular connector enables the hybrid use of EBP technology with other media such as electrical signals or air and fluids. The robust interfaces enable automatic or manual docking with a high number of mating cycles.

With the extension to the MINI-SNAP, MEDI-SNAP and ODU-MAC series, ODU now offers more solutions for an even wider range of industries and applications. Further information about Expanded Beam Performance can be found at www.odu-connectors.com.

Über die ODU GmbH & Co. KG

ODU Group: global representation with perfect connections

The ODU Group is one of the world’s leading suppliers of connector systems, employing 2,700 people around the world. In addition to its company headquarters in Muehldorf a. Inn (Germany), ODU also has an international distribution network, production and product development sites in Sibiu/Romania, Shanghai/China, Tijuana/Mexico and Camarillo/USA. ODU combines all relevant areas of expertise and key technologies including design and development, machine tooling and special machine construction, injection, stamping, turning, surface technology, assembly and cable assembly. The ODU Group sells its products globally through its sales offices in Austria, China, Denmark, France, Germany, Hong Kong, Italy, Japan, Korea, Sweden, UK and the US, as well as through numerous international sales partners. ODU connectors ensure a reliable transmission of power, signals, data and media for a variety of demanding applications including medical technology, military and security, automotive, industrial electronics, and test and measurement.

Firmenkontakt und Herausgeber der Meldung:

ODU GmbH & Co. KG
Pregelstraße 11
84453 Mühldorf a. Inn
Telefon: +49 (8631) 6156-0
http://odu-connectors.com/de/

Ansprechpartner:
Daniel Klemisch
Product Marketing Specialist
Telefon: +49 (8631) 6156-1695
E-Mail: daniel.klemisch@odu.de
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