DRAM PRO series from Innodisk

Innodisk’s DRAM PRO series is specifically designed for use in harsh environments. The ultra-temperature DRAM modules offer robust performance under extreme conditions. This module ensures long-term stability in an extended operating temperature range of -40 °C to +125 °C for DDR4 and -40 °C to +105 °C for DDR5. For systems that require efficient heat dissipation, such as fanless embedded systems, the DDR5 Long DIMM Heat Spreader effectively cools the heat during operation. Innodisk’s Rugged DIMM and XR DIMM DRAM modules are specifically designed for extreme vibration and shock scenarios. These modules feature customised sockets and two mounting holes to ensure a secure and stable connection to the motherboard. Innodisk’s Rugged Clips are another solution for DRAM modules that come loose from the DIMM slot due to vibration. They are cost-effective and have been vibration tested by a third party to ensure reliability while reducing maintenance costs.

Typical applications include logistics, automotive, aerospace and fanless systems.

The DDR4 and DDR5 DRAM modules offer anti-sulphurisation and side fill to ensure uninterrupted operation. All modules exceed the JEDEC standard and have certifications for operation in the extended temperature range of -40 °C to +95 °C for wide temperature modules and up to 125 °C for ultra temperature modules.

The robust DIMMs comply with the 1.2 V JEDEC standard and the 260-pin JEDEC standard. They have an 8-bit pre-fetch and OCD (off-chip driver impedance matching). The programmable burst length is 4 or 8 bits with sequential and interleave modes. The RoHS compliant modules with CE/FCC certification have a 30μ" gold finger overlay and are equipped with 2 mounting holes to ensure a secure connection. The customised connectors also prevent the DIMM from coming loose in the event of shocks and vibrations.

The clips, made of robust PANLITE® PC material, are attached to both sides of the DRAM slot and ensure high stability of the module and high impact resistance. They provide a secure connection between the DRAM socket and module in vibrating environments, reducing the risk of disconnection and ensuring proper system operation, unlike the irregular adhesive or rubber band method, which can leave residue and affect DRAM performance. The robust clips are tested according to EIA 364-28 VII. This is an official third-party vibration test to increase their reliability. They are fully tested and optimised for stability and performance. Only original ICs are used to fulfil the strict industry standards.