GIGABYTE Exhibits at the San Jose OCP Global Summit and Announces new AMD EPYC OCP V3 Compute Nodes

The new GIGABYTE OCP ORv3 products include a 2OU node tray, TO25-BT0, and AMD Genoa compute nodes: TO25-Z10, TO25-Z11, and TO25-Z12. For immersion cooling server deployment with ORv3 specifications is the new GPU server based on AMD Genoa: TO15-Z40.

From entry-level computing to DevOps and to hybrid HPC / AI workloads using both CPU and GPU, the new AMD Genoa compute nodes cover a wide range of use cases with features such as optimized cooling design for maximum CPU TDP support at 400W, full-height full-width slots for up to four double-width GPU cards, large local storage with up to 12x E1.S drives, and 24x DDR5 DIMM slots. For the CPU performance along, the AMD Genoa and Genoa-X line-ups allow for the highest CPU core count per socket (up to 128 physical cores and up to 1.15GB L3 cache).     

“Our commitment to support Open Compute Project’s designs dates back almost a decade starting with our OCP v1.0 products, and now we are releasing some well-designed, in demand ORv3 products. Through discussions with several customers, we decided to move forward with the development of these configurations. These designs check the boxes for specifications that are required,” said Vincent Wang, Sales VP at Giga Computing. “We will continue supporting ORv3 specifications and we have more products on the horizon in Q1 2024.”

Taking place on October 17-19 at the San Jose Convention Center, the 2023 OCP Global Summit is a community gathering of people, technology, and products that promotes IT hardware innovations. Efficiency, impact, openness, scalability, and sustainability are the OCP tenets that drive a community approach to problem solving. And that is why GIGABYTE supports their initiative and will have a booth at the Global Summit.

The GIGABYTE booth, #A23, will follow the vision of these tenets by demonstrating our immersion cooling tanks and servers that can considerably reduce total energy consumption and costs in the data center while gaining performance and reliability. For this summit, we showcase at the GIGABYTE booth an OCP ORv3 rack to exhibit our solutions. Starting with the new OCP tray (TO25-BT0), it houses a compute node for AMD EPYC (TO25-Z11) platform. And for those with a storage focus is our ORv3 JBOD server that supports up to 32 drives in a 2OU chassis.

The 4th Gen AMD EPYC™ processors, powered by “Zen 4c” architecture, offer the performance, density, energy efficiency and compatibility needed to provide no-compromise computing for growing data center environments.

The path to AMD’s 5nm ‚Zen 4‘ architecture was paved with many successful generations of EPYC innovations and chipset designs, and AMD EPYC 9004 Series processors continue this progression. Adding a host of new features to target a wide range of workloads, this family of EPYC processors will deliver even better CPU performance and performance per watt and do so on a platform with 2x the throughput of PCIe 4.0 lanes that also has support for 50% more memory channels. For this platform, GIGABYTE has products ready to get the most out of EPYC CPU-based systems that support fast PCIe Gen5 accelerators and Gen5 NVMe drives, in addition to support for high performant DDR5 memory.

Join GIGABYTE at booth #A23 to discuss how we can help you build a data center of the future.

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