Just like previous EpiX generations, the novel system is equipped with white light reflectance and multi-wavelengths photoluminescence spectroscopy for wafer inspection.
Now the system has been equipped with fully automated wafer handling and cassette-to-cassette wafer loading to also serve the requirements of high-throughput industrial applications. Detailed information can be found in the new EpiX data sheet.
Dr. Johannes Zettler will also give a detailed presentation about this new product at LayTec‘s in-situ seminar at ICMOVPE XX. For registration, please click here.
The LayTec team is looking forward to welcoming you at the LayTec booth at ICMOVPE XX.
LayTec develops and manufactures integrated in-situ, in-line and at-line metrology for thin film deposition processes. LayTec’s metrology tools provide real-time access to all key parameters during deposition processes – either in-situ during the process, in-line during substrate transfer between deposition chambers, or at-line for process development and research of novel materials.
LayTec’s metrology is used worldwide by industry and development. The company’s strength lies in rapid innovation and timely market delivery of new systems, adaptable around standardized core hardware and software structures. We work closely with technology leaders in the fields of electronics and opto-electronics, equipment manufacturers for various etching and thin-film deposition systems, and leading research institutions, to achieve the most advanced thin-film process analysis and control.
For more information about our products and services, please visit www.laytec.de
LayTec AG
Seesener Str. 10-13
10709 Berlin
Telefon: +49 (30) 3980080-0
Telefax: +49 (30) 3980080-80
http://www.laytec.de
