In self-driving vehicles, there are not only increased requirements for data processing. Additional heat, for example, from direct exposure to heat in very small housings cause additional problems. Fanless embedded systems are usually operated in harsh environments where there is little space for heat sinks and fans. This poses the risk of system crash or permanent damage if the system temperature exceeds specification. Mission-critical systems require absolute reliability sometimes in environments not suitable for electronic applications. They often operate in ambient temperatures that would destroy a normal system.
Innodisk offers free upgrades to their products to ensure performance in critical environments. A 45μ" gold finger overlay provides a more robust, reliable connection than the typical 30μ" gold finger on industrial-grade DRAMs. Side Fill technology protects and strengthens sensitive solder joints from thermal and mechanical stress. Anti-Sulfuration provides an additional layer of protection to sensitive parts, guarding against sulfur corrosion of silver alloys. A built-in temperature sensor permanently measures and tracks component temperature.
To earn the Ultra Temperature label, components are verified to the AEC-Q200 automotive qualification by third-party testers. This includes the Gold Finger Insertion and Extraction Test in 100 cycles. The thermal shock and vibration test complies with MIL-STD-810G United States Standard and the drop test is conducted according to ISTA-1A International Safe Transit Association. The Electronic Industry Association of Japan EIAJ-4072 sets the requirements for the bending test.
The ultra-temperature DRAM module is capable of operating in a higher temperature range without error or failure. This streamlines the development of systems in harsh environments. The need for this will increase. The market for self-driving vehicles in particular will expand rapidly in the next few years. It is forecast here to grow to around USD 65 billion in 2026, which corresponds to an average growth rate of more than 20% per year.
Modern industrial designs are becoming more and more compact, and heat-generating intensive computing and data processing are increasingly being built into smaller and smaller units. The heat-sensitive components must be accommodated in the cramped designs without system or functional limitations. Normally, components for use in industrial applications are designed for a temperature range of -40°C to +85°C. Innodisk’s Ultra Temperature memory supports a temperature range of -40°C to +125°C. This makes these components suitable for temperature sensitive applications. Innodisk offers free upgrades to their products to ensure performance in critical environments. A 45μ" Goldfinger overlay provides a robust and reliable connection. Side Fill technology protects sensitive solder joints from thermal and mechanical stress. Anti-sulfuration provides an additional layer of protection to sensitive parts. A built-in temperature sensor permanently measures and checks component temperature. Components are verified to AEC-Q200 automotive qualification by external testers. The ultra-temperature DRAM module is capable of operating over a higher temperature range without error or failure. This streamlines the development of systems in harsh environments.
#Innodisk #UltraTemperatureMemory
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