The new multi-cell battery protection IC has many features helping users simplify their manufacturing process. First, it reduces heat generation at large current by using a low-resistance SENSE resistor, making thermal design of a board easy. Second, separating the charge and discharge paths enables using a battery pack with low impedance. Third, thanks to the high-voltage cell monitor pins, there are no constraints on connection orders. Fourth, although the IC is designed for three-to-five-cell battery packs, it can also correspond to battery packs including six or more cells by connecting two or more ICs in cascade. The simple cascading structure contributes to reducing external components.
Additionally, the IC adopts the small TSSOP-24 package.
The R5651 series will strengthen your products‘ competitive edge by achieving high accuracy and low power consumption.
Product Name R5651 Series
Sample Price JPY 550 (Tax Included / 1,000 pcs)
Sample Order Start Date February 24, 2022
Package TSSOP-24 (7.8×6.4×0.9 mm)
Monthly Production 1 million
Features
- Industry-leading High-accuracy Overcharge Detection (OVP)
Overcharge detection voltage range: 3.60 V to 4.50 V, Accuracy: ±25 mV
- Industry-leading High-accuracy Over discharge Detection (UVP)
Over discharge detection voltage range: 2.0 V to 3.2 V, Accuracy: ±50 mV
- Highest Level of Low Voltage and High Accuracy We Ever Achieved by Lowering Resistance of Current Sense Resistor
Discharge overcurrent detection voltage accuracy: 10 mV to 30 mV, ±3 mV
Charge overcurrent detection voltage accuracy: -8 mV to -30 mV, ±3 mV
- Temperature Protection: Industry-leading High Accuracy of ±3°C
Charge Low (TDCL) setting: -5 / -3 / 0 °C, Accuracy: ±3°C
Charge High (TDCH) setting: 45 / 50 / 55 / 60 °C, Accuracy: ±3°C
Discharge High (TDDH) setting: 65 / 70 / 75 °C, Accuracy: ±3°C
- High-voltage Cell Monitor Pins
Contributes to simplifying circuit connection by removing connection orders.
- Cascade Connection
Can correspond to six- or more-cell batteries by connecting two in cascade.
- Package
Adopts TSSOP-24 (7.8 × 6.4 × 0.9 mm), a small package with leads. Features high durability and is resistible to vibrations generated from power tools.
About Nisshinbo Micro Devices Inc.
Nisshinbo Micro Devices Inc. is the result of the integration of former New Japan Radio Co., Ltd. and former RICOH Electronic Devices Co., Ltd. Both companies, having contributed to expanding the Nisshinbo Group’s microdevices business so far, will further grow as an "Analog Solution Provider" for growing markets by strengthening our structure and achieving synergies through business integration.
Nisshinbo Micro Devices will provide analog solutions through electronic devices and microwave products based on the strength of analog technology in accordance with the Nisshinbo Group’s corporate philosophy of "Change and Challenge! For the creation of the future of Earth and People". We will contribute to developing connected society, and aim to be a company with value and presence that is expected by customers around the world.
For more information, go to https://www.nisshinbo-microdevices.co.jp/en/.
About Macnica ATD Europe GmbH, (former Macnica GmbH)
Macnica’s ATD Europe GmbH, (former Macnica GmbH), was originally established in the UK in 2006, and moved to Germany in July 2008, to increase efficacy of its service for European customers.
By it’s acquisition of the Munich based company Scantec Mikroelektronik in 2014 Macnica Europe formed a powerful semiconductor distribution with headquarter in Ingolstadt and offices in Munich, Regensburg, Milton Keynes (UK) and Warsaw of-fering an attractive and competitive portfolio of highly sophisticated devices.
Macnica provides end to end support from design-in to production through its global service network to its customers, regardless of the final destination of the product shipment to customers‘ manufacturing locations.
About Macnica ATD Europe S.A.S.
Founded in 1990 as ATD Electronique, Macnica ATD Europe headquarter offers in-novative components dedicated to imaging applications for the European market. Its product portfolio includes: image sensors (CCD, CMOS, InGaAs, Thermal etc.), op-tics, interface circuits, FPGA & IPs, imaging processors, cables and OLED micro-displays.
It also covers development tools and design services enabling fast and efficient reali-zation of new high-performance camera systems for markets such as machine vision, medical, life sciences, surveillance, automotive and others. After the acquisition of the company by Macnica Inc. as of October 1, 2020 the company operates under the name Macnica ATD Europe.
About Macnica, Inc.
Macnica was established in 1972 as a semiconductor distribution company headquar-tered in Yokohama, Japan, and has over 85 sales offices worldwide in eastern Asia, Europe and the USA. Total number of employees is over 3,000 and its consolidated revenue for fiscal 2020 was approximately US$ 5.5 B.
Macnica is famous for having an excellent engineering team of more than 900 appli-cation support engineers, IC designers and software developers with strong focus on providing technical support for its customers including custom design services. Mac-nica is continuing to extend its presence globally by having successful partners in strategic areas in the electronics market.
Macnica ATD Europe GmbH
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http://www.macnica.eu/de
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