Industrial electronic packaging market projected to witness vigorous expansion by 2029

Leading companies profiled in the FMI report for the industrial electronics packaging market include DS Smith Plc., Smurfit Kappa Group Plc., UFP Technologies, Inc., Sealed Air Corporation, Achilles Corporation, Desco Industries Inc. and Botron Company. .. I have. Inc., Kiva Container Corporation, Orlando Products Inc., Delphon Industries, LLC, Summit Container Corporation, Protective Packaging Corporation, Dou Yee Enterprises (S) Pte Ltd., Dordan Manufacturing Company, Inc., GWP Group Limited, Pure-Stat Engineered Technologies, Inc., AUER Packaging GmbH, Emballages Cre-O-Pack International Inc. and Universal Protective Packaging, Inc. and others.

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From a material perspective, plastics currently hold an approximately 60% share of the industrial electronics packaging material, maintaining its dominance in the global industrial electronics packaging market. The report revealed that polyethylene (PE) remains the most valuable segment of the industrial electronic packaging market, followed by polyvinyl chloride (PVC).

Digitization for All-Weather Packaging – Big Illustration Rendering Future in the Market

The demand for fragile and sensitive industrial electronic products continues to grow in various end-user industries, increasing the need for all-weather protection packages. Manufacturers are expanding the growth of the Internet of Things (IoT) market to move forward with the arrival of the Fourth Industrial Revolution. The ongoing trend of digitalization will continue to change the packaging industry and expand the range of implementation of IoT technology to provide sophisticated industrial electronic packaging solutions.

Asian economy holds promising investment opportunities for industrial electronic packaging companies

North America is estimated to be the most prominent industrial electronic packaging market, and the report also points out that the East Asian market will grow significantly in attractiveness over the next few years. Therefore, according to FMI’s analysis, the East Asian market for industrial electronic packaging remains a key regional competitor in the industrial electronic packaging environment.

In East Asia, Japan has more than 50% of the market share, followed by China. South Asia is also cited as a highly profitable investment region by manufacturers of industrial electronic packaging solutions that potentially outperform other regional markets in terms of growth rate. The growth of the South and East Asian markets is due to the strong manufacturing of consumer electronics and the increasing demand for impact-resistant protective packaging solutions.

Europe is another prominent market for industrial electronic packaging, with Germany accounting for more than 60%. With the high production speed of semiconductor parts and equipment, the country will continue to lead the European market.

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Key segment : 

By product type

• Testing and measuring equipment
• Process control device
• Industrial control
• Power electronics

By material

• plastic
  • Polyethylene (PE)
  • Polyethylene terephthalate (PET)
  • Polypropylene (PP)
• Paper and carton

By packing type

• Strict
  • Cardboard box
  • Containers and shipping companies
  • Protective packaging
• flexible
  • Bag and pouch
  • Tape and label
  • Movies etc.

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Table of contents

1. Execution summary

         1.1. Global Market Outlook

         1.2. Analysis and recommendations

2. Market Overview

         2.1. Market Scope/Classification

         2.2. Market Definition / Scope / Limits

3. Key market trends

         3.1. Key trends affecting the market

         3.2. Product innovation / development trends

4. Global Industrial Electronic Packaging Market Demand Analysis 2014-2018 and Forecast, 2019-2029

         4.1. Historical Market Size (Tons) Analysis, 2014-2018

         4.2. Current and Future Market Size (Tons) Forecast, 2019-2029

         4.3. YoY Growth Trend Analysis

5. Global Industrial Electronic Packaging Market – Price Analysis

         5.1. Price analysis by region by packaging type

         5.2. pricing

         5.3. Global Average Price Analysis Benchmark