Espressif Systems (Shanghai) Co., Ltd. (SSE: 688018.SH) announces today the upcoming release of ESP32-H2 with IEEE 802.15.4 and Bluetooth 5.2 (LE) connectivity, operable in the 2.4 GHz band. ESP32-H2 enhances Espressif’s SoC portfolio further beyond Wi-Fi and Bluetooth connectivity by adding IEEE 802.15.4 connectivity as well. This SoC comes with an integrated DC-DC converter that enables ultra-low-power, energy-efficient operation. Espressif is very proud to mention that the Bluetooth 5.2 subsystem has been designed exclusively by its own engineering team.
ESP32-H2 combines two important connectivity technologies. IEEE 802.15.4 radio connectivity has been important to the supported mesh architecture with low power consumption. The availability of Thread and ZigBee protocols address a variety of application use-cases. Bluetooth LE supports point-to-point, broadcast and mesh communication topologies, while it also enables a direct communication between the smartphone and the device.
Additionally, ESP32-H2 takes advantage of Bluetooth 5.2 technology and supports its new features. Bluetooth 5.2 provides LE Isochronous Channels support that enables building devices for LE Audio, the next generation of Bluetooth audio. Not only will LE Audio enhance Bluetooth audio performance, but it will also add support for broadcasting audio and enabling Audio Sharing. The LE Power Control and Enhanced Attribute Protocol of Bluetooth 5.2 also improve the device efficiency even further. ESP32-H2 also provides full support for the Bluetooth mesh protocol and will support the upcoming Bluetooth mesh 1.1.
The combined availability of IEEE 802.15.4 and Bluetooth LE connectivity enables building devices for the upcoming Matter protocol that intends to bring interoperability for Smart-Home devices. With ESP32-H2 and other SoCs in its portfolio, Espressif can offer the full spectrum of Matter protocol solutions for endpoints with Wi-Fi or Thread connectivity, as well as for border router implementations using a combination of SoCs.
ESP32-H2 has a single-core, 32-bit RISC-V microcontroller that can be clocked up to 96 MHz. It has a 256 KB SRAM and works with external flash. It has 26 programmable GPIOs with support for ADC, SPI, UART, I2C, I2S, RMT, GDMA and PWM. ESP32-H2 continues to facilitate building secure connected devices through hardware security features such as ECC-based secure boot, AES-128/256-XTS-based flash encryption, digital signature and an HMAC peripheral for identity protection, as well as cryptographic accelerators for improved performance.
ESP32-H2 will support Thread version 1.x and ZigBee 3.x. Espressif, as an active member of CSA, will continue to develop and support the Matter protocol on ESP32-H2 for as long as the standard progresses. ESP32-H2 will be supported through Espressif’s mature IoT Development Framework (ESP-IDF), so that our customers can benefit from their familiarity with our field-proven platform that already powers millions of connected devices.
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About Espressif Systems
Espressif Systems (Shanghai) Pte. Ltd. is a fabless semiconductor company, with headquarters in Shanghai Zhangjiang High-Tech Park, providing low power Wi-Fi and Bluetooth SoCs and wireless solutions for the Internet of Things (IoT). The company build the widely popular ESP8266 and ESP32 chips with an innovative team of chip-design specialists, software and firmware developers and marketers. Espressif is committed to providing the best IoT devices and software platforms in industry.
The company also helps their customers build their own solutions and connect with other partners in the IoT ecosystem. Their passion lies in creating state-of-the-art chipsets and enabling partners to deliver great products.
Espressif’s products are widely deployed in the tablet, OTT boxes, cameras, and Internet of Things markets.
For more information, please visit https://www.espressif.com.
Macnica’s European headquarter was originally established in the UK in 2006, and moved to Germany in July 2008, to increase efficacy of its service for European cus-tomers.
By it’s acquisition of the Munich based company Scantec Mikroelektronik in 2014 Macnica Europe formed a powerful semiconductor distribution with headquarters in Munich and Ingolstadt and numerous sales offices in Europe offering an attractive and competitive portfolio of highly sophisticated devices.
Macnica provides end to end support from design-in to production through its global service network to its customers, regardless of the final destination of the product shipment to customers‘ manufacturing locations.
About Macnica, Inc.
Macnica was established in 1972 as a semiconductor distribution company headquar-tered in Yokohama, Japan, and has over 84 sales offices worldwide in eastern Asia, Europe and the USA. Total number of employees is over 3,000 and its consolidated revenue for fiscal 2019 was approximately US$ 5 B.
Macnica is famous for having an excellent engineering team of more than 900 appli-cation support engineers, IC designers and software developers with strong focus on providing technical support for its customers including custom design services. Mac-nica is continuing to extend its presence globally by having successful partners in strategic areas in the electronics market.
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